Inforce leverages mobile and Internet technologies to provide long lifecycle Qualcomm® Snapdragon™ processor-based miniature compute platforms. Inforce also provides hardware and software design, and manufacturing services to help customers innovate, accelerate, and scale their designs to market.
The main competencies of Inforce are in the fields of:
Qualcomm® Snapdragon™ processor-based off-the-shelf embedded boards, single board computers, system on modules, build-to-order boards, custom design engineering services, BSP & driver development. Inforce provides targeted/ready-made building blocks optimized for industry specific applications to take your design to the market faster. Vertical specific solutions in robotics/UAV, videoconferencing/collaboration, medical imaging, and wearable hands-free computing can be quickly put together with several readily available hardware and software building blocks, such as:
Software and SDKs from Qualcomm and other 3rd parties that work with Inforce’s Snapdragon based platforms include:
More than 50
Off the shelf (OTS) Single-board-computers (SBCs), System-on-Modules (SoMs), Development Kits
Inforce Computing designs and manufactures purpose built SoMs, SBCs, and full-fledged development kits based on four generations of advanced Qualcomm Snapdragon applications processors. These plug-and-play products provide high-density compute and connectivity demanded by next-gen embedded systems. The Inforce SoMs are cross compatible with multiple Snapdragon family based platforms, ensuring easy migration to newer mobile technologies. Inforce's OTS SoMs and SBCs are production ready for volume manufacturing.
Custom Hardware and Software Design Services
Inforce also provides custom hardware and software design services, while taking customers through stringent FCC, FDA, CE, and UL certifications to accelerate customer designs to market. Inforce also provides products that can fit into extended operating temperature ranges (-30C to +85C).
Inforce also designs and sells accessories such as high-resolution and stereo camera modules, LCD/touch control displays, sensor boards, peripheral abstraction core mezzanine cards, etc.